Name
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Product Family:
RelLogNumber:
Cell:
CCT:
CRI:
Stress Condition:
Fail Code:
Failure Bucket:
Notes:
dPhiv [%]
dPhie [%]
du’v’ [x1000]
du' [x1000]
dv' [x1000]
dx [x1000]
dy [x1000]
dLdom [nm]
dLpk [nm]
dVf [%]
Statistics to report:
Reliability Datasheet Template:
Product Family Sales P/N Manufacturer location Epi Description Chip Description Phosphor Recipe Process Silicone Encapsulation Ceramic/Leadframe
Molding Material
Ceramic/Leadframe
Supplier
Gold wire Die attach adhesive TVS Other Note Cell CCT CRI RelLogNumber Readout Fail Code Failure Bucket Notes BoardID SerialNumber StressCondition StressTool TestCurrent PHIv (mLm) dPHIv (%) u'v'_shift If (mA) Vf (V) dVf (%) Rs (ohm) Ldom (nm) dLdom (nm) x dx y dy u' du' v' dv' Purity CCT PHIe (W) dPHIe (%) EQE (%) WPE (%) Lpk (nm) dLpk (%) LCen (nm) Vf2 (V) Vr1 (V) BOM Author Date RawByRow Author Date